Dr. Kalpana Chauhan

Dr. Kalpana Chauhan (M’13-SM’17) graduated in Electrical and Electronics Engineering from The College of Engineering Roorkee, India. She received her M. Tech degree in Control and Instrumentation Engineering from Dr. B. R. Ambedkar National Institute of Technology Jalandhar, India and PhD in Electrical Engineering from the Indian Institute of Technology Mandi, India. Presently She is working as Assistant Professor (Senior Grade) at the Galgotias College of Engineering and Technology Greater Noida. Dr. Chauhan worked as Dean (Research) at SIRDA Group of Institutions Sundernagar, India (2013-2017). She has also worked as Visiting Scientist in the Center for Electromechnics at the University of Texas at Austin, US. Dr. Kalpana Chauhan received Best Paper award in 8th IEEE Colloquium on Signal Processing & Its Applications (CSPA 2012), held in Melaka Malaysia during 23 to 25 March 2012 and International Conference on Methods and Models in Science and Technology (ICM2ST-11), held in Jaipur in Nov 2011. She has also received Ministry of Human Resource and Development (MHRD) Fellowships for pursuing M.Tech (2007) and Ph.D. (2009). Her special field of interest included DC Micro-grid, Building Automation System, Industrial Automation and Control. She is a senior member of Institute of Electrical and Electronics Engineers (IEEE), Member of the International Association of Engineers (IAENG) Hong Kong, International Association of Computer Science and Information Technology (ICASIT) Singapore, The Institution of Engineers (India), Institute of Doctors Engineers and Scientists (IDES), Associate member of The Institution of Engineers (India). He is an Editor of International Journal of Advanced Computer Science and Information Technology, Switzerland, Member of Scientific Committee, International Engineering and Natural Science Conference (IENSC2018), will take place on November 14-17, 2018 in Diyarbakir, Turkey. She is also a member of review board of various journals of the reputed society such as Elsevier, Springer and IEEE.